electroless

简明释义

英[ɪˈlektrəʊləs]美[ɪ'lɛk,trolɪs]

adj. 无电镀的

英英释义

单词用法

同义词

反义词

例句

1.Electroless plating is one of the best technology for metal surface intensity.

化学镀是一种优良的金属材料表面强化工艺。

2.Electroless plating technique has been widely used because of its unique advantages.

化学镀镍技术，以其独特的优越性正被广泛应用。

3.The influence factor on low-phosphorous electroless nickel plating is studied.

对低磷化学镀镍的影响因素进行了初步研究。

4.Is there an active continuous improvement team for plating voids in the electroless copper operation?

化学沉铜是否对电镀空洞有积极的持续改善小组？

5.Acid electroless nickel phosphorus plating on PZT ceramic was studied with hypophosphite as a reducing agent.

以次亚磷酸钠为还原剂，在压电陶瓷表面进行酸性化学镀镍磷。

6.The results show that the fatigue life of electroless Ni-P alloy specimen could be dropped.

结果表明，化学镀镍磷合金之后，镀态试样的疲劳寿命明显下降；

7.The process of electroless 无电镀 plating is widely used in the electronics industry to create conductive surfaces.

无电镀工艺在电子行业中被广泛用于创造导电表面。

8.In manufacturing, electroless 无电镀 nickel plating can enhance corrosion resistance.

在制造业中，无电镀镍涂层可以增强耐腐蚀性。

9.The electroless 无电镀 deposition method is preferred for coating complex shapes.

无电镀沉积方法更适合用于涂覆复杂形状。

10.Using electroless 无电镀 gold plating can improve the performance of connectors in electronic devices.

使用无电镀金涂层可以提高电子设备连接器的性能。

11.The electroless 无电镀 process allows for uniform coating without the need for an electric current.

无电镀工艺允许均匀涂层而无需电流。

作文

In the field of materials science and engineering, the term electroless refers to a plating process that does not require an external electrical current to deposit a metal layer onto a substrate. This method is particularly valuable in applications where uniform coating is essential, such as in the electronics industry. The electroless plating process involves a chemical reaction that reduces metal ions in a solution, allowing them to adhere to the surface of the object being coated. One of the most common metals used in this process is nickel, which is often deposited onto various substrates to improve their corrosion resistance and wear properties. The advantages of electroless plating are numerous. Firstly, it provides excellent coverage even on complex geometries and hard-to-reach areas, which is a significant advantage over traditional electroplating methods. This makes electroless plating ideal for intricate electronic components, such as circuit boards and connectors. Additionally, the electroless process can produce a very uniform thickness of the metal layer, which is crucial for ensuring consistent performance in electronic applications. Another important aspect of electroless plating is its ability to enhance adhesion between the metal layer and the substrate. The chemical nature of the electroless process allows for better bonding, which can lead to improved durability and longevity of the coated product. This is particularly important in industries where components are subjected to harsh environments or mechanical stress. Moreover, electroless plating can be more environmentally friendly compared to some traditional plating methods. Since it does not require the use of electricity, it can reduce energy consumption during the manufacturing process. Furthermore, advancements in chemistry have led to the development of electroless solutions that minimize the use of toxic chemicals, making the process safer for both workers and the environment. However, it is essential to note that electroless plating does have some limitations. For instance, the initial setup costs for electroless plating systems can be higher than those for traditional electroplating. Additionally, the deposition rate of electroless plating is generally slower than electroplating, which may impact production timelines. Companies must weigh these factors when deciding whether to implement electroless plating in their manufacturing processes. In conclusion, the electroless plating process offers a unique and effective way to apply metal coatings without the need for electrical current. Its ability to provide uniform coverage, enhance adhesion, and potentially reduce environmental impact makes it a valuable technique in various industries, particularly electronics. As technology continues to advance, the applications and efficiency of electroless plating are likely to expand, further solidifying its role in modern manufacturing. Understanding the principles and benefits of electroless plating is essential for anyone involved in materials science or engineering, as it represents a critical intersection of chemistry, technology, and practical application.

在材料科学和工程领域，术语electroless指的是一种电镀工艺，该工艺不需要外部电流来将金属层沉积到基材上。这种方法在需要均匀涂层的应用中尤其有价值，例如在电子行业。electroless电镀过程涉及一种化学反应，该反应还原溶液中的金属离子，使其能够附着在被涂覆物体的表面上。最常用的金属之一是镍，通常沉积在各种基材上，以提高其耐腐蚀性和耐磨性。 electroless电镀的优点有很多。首先，它即使在复杂几何形状和难以到达的区域也能提供出色的覆盖，这相较于传统的电镀方法具有显著优势。这使得electroless电镀成为复杂电子组件的理想选择，例如电路板和连接器。此外，electroless过程可以产生非常均匀的金属层厚度，这对确保电子应用中的一致性能至关重要。 electroless电镀的另一个重要方面是它能够增强金属层与基材之间的粘附性。electroless过程的化学性质允许更好的结合，这可能导致涂层产品的耐用性和使用寿命提高。这在组件暴露于恶劣环境或机械应力的行业中特别重要。 此外，与某些传统电镀方法相比，electroless电镀可能更环保。由于它不需要使用电力，因此可以减少制造过程中的能耗。此外，化学技术的进步促使开发出减少有毒化学品使用的electroless溶液，使该过程对工人和环境更安全。 然而，需要注意的是，electroless电镀确实存在一些局限性。例如，electroless电镀系统的初始设置成本可能高于传统电镀。此外，electroless电镀的沉积速率通常比电镀慢，这可能影响生产时间表。公司在决定是否在其制造过程中实施electroless电镀时，必须权衡这些因素。 总之，electroless电镀过程提供了一种独特而有效的方法，可以在不需要电流的情况下施加金属涂层。其提供均匀覆盖、增强粘附性以及潜在降低环境影响的能力，使其在各个行业，特别是电子行业中成为一种有价值的技术。随着技术的不断进步，electroless电镀的应用和效率可能会进一步扩展，从而巩固其在现代制造中的角色。理解electroless电镀的原理和优点对于任何参与材料科学或工程的人来说都是至关重要的，因为它代表了化学、技术和实际应用的关键交叉点。